Product Information

• Part Number: SR3GH
• Manufacturer: Intel
• Product Name: Intel Xeon 4110 8-Core 2.1GHz 11MB LGA3647 Processor SR3GH
• Release Date: July 2017 (for Skylake-SP series)
• Warranty: 3 Years Limited Warranty (Intel's standard warranty for boxed processors)

Product Description

The Intel Xeon Silver 4110 processor (SR3GH) is an 8-core, 16-thread CPU designed for single-socket or dual-socket server and workstation platforms. Part of Intel's scalable Xeon Silver family, it operates at a base clock speed of 2.1 GHz and can reach a max turbo frequency of 3.0 GHz. It features an 11 MB L3 cache and supports up to 6 channels of DDR4-2400 ECC memory, making it suitable for entry-level data center workloads, network appliances, and storage solutions where energy efficiency and core count are important. Built on the Skylake-SP microarchitecture, it leverages Intel's advanced technologies to deliver reliable performance for foundational compute tasks.

Product Specifications

• Processor Family: Intel Xeon Silver
• Processor Model: 4110
• Cores: 8
• Threads: 16
• Base Clock Speed: 2.1 GHz
• Max Turbo Frequency: 3.0 GHz
• Cache: 11 MB L3 Cache
• Socket Type: LGA 3647
• TDP: 85 W
• Instruction Set: 64-bit
• Instruction Set Extensions: Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
• Lithography: 14 nm
• Memory Channels: 6
• Memory Type Supported: DDR4-2400 ECC
• Max Memory Size: 768 GB (per socket, depending on platform)
• Scalability: 2S (Dual Socket Support)
• PCIe Lanes: 48
• Intel Optane Memory Supported: Yes
• Intel Turbo Boost Technology: 2.0
• Intel Hyper-Threading Technology: Yes
• Intel Virtualization Technology (VT-x): Yes
• Intel VT-d for Directed I/O: Yes
• Intel TSX-NI: No
• Intel AES New Instructions: Yes
• Enhanced Intel SpeedStep Technology: Yes

Package includes:
Processor Only

• Octa-core (8 cores) processor for efficient multitasking
• Base frequency: 2.10 GHz, Max Turbo frequency: 3.00 GHz
• 11 MB L3 cache and 8 MB L2 cache for quick access to data
• 64-bit processing for enhanced computational capacity
• Manufactured using 14 nm technology for better thermal performance
• Socket 3647 for compatibility with a variety of server architectures
• Thermal Design Power (TDP) of 85 W for efficient energy consumption